Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
Intel® Deep Learning Boost (Intel® DL Boost)
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.
Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.
Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Specifications
Processor manufacturer | Intel |
Processor generation | 13th gen Intel® Core™ i9 |
Processor model | i9-13900F |
Processor family | Intel® Core™ i9 |
Processor cores | 24 |
Processor socket | LGA 1700 |
Processor threads | 32 |
Processor operating modes | 64-bit |
Performance cores | 8 |
Efficient cores | 16 |
Processor boost frequency | 5.6 GHz |
Performance-core boost frequency | 5.2 GHz |
Performance-core base frequency | 2 GHz |
Efficient-core boost frequency | 4.2 GHz |
Efficient-core base frequency | 1.5 GHz |
Processor cache | 36 MB |
Processor cache type | Smart Cache |
Box | N |
Processor base power | 65 W |
Maximum turbo power | 219 W |
Maximum number of DMI lanes | 8 |
Processor codename | Raptor Lake |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
Memory channels | Dual-channel |
Memory bandwidth (max) | 89.6 GB/s |
On-board graphics card | N |
Discrete graphics card | N |
On-board graphics card model | Not available |
Discrete graphics card model | Not available |
Execute Disable Bit | Y |
Idle States | Y |
Thermal Monitoring Technologies | Y |
Market segment | Desktop |
Use conditions | PC/Client/Tablet |
Maximum number of PCI Express lanes | 20 |
PCI Express slots version | 4.0, 5.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | AVX 2.0, SSE4.1, SSE4.2 |
Scalability | 1S |
CPU configuration (max) | 1 |
Embedded options available | N |
Direct Media Interface (DMI) Revision | 4.0 |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | 740.17B1 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel® Speed Shift Technology | Y |
Intel® Thermal Velocity Boost | Y |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.5 GHz |
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0 | Y |
Intel® Thermal Velocity Boost Frequency | 5.6 GHz |
Intel® Control-flow Enforcement Technology (CET) | Y |
Intel® Thread Director | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® Secure Key | Y |
Intel® OS Guard | Y |
Intel 64 | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
Intel Turbo Boost Max Technology 3.0 | Y |
Intel® Boot Guard | Y |
Intel® Deep Learning Boost (Intel® DL Boost) | Y |
Intel® Volume Management Device (VMD) | Y |
Mode-based Execute Control (MBE) | Y |
Intel® Standard Manageability (ISM) | Y |
Tjunction | 100 °C |
Launch date | Q1'23 |
Processor package size | 45 x 37.5 mm |
L2 cache | 32768 KB |