BX8070110100F Intel Core i3-10100F processor 3.6 GHz 6 MB Smart Cache Box

61.72$ex. VAT

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Condition: New
GTIN: 5032037192620

2 pcs in stock
Delivery: 2 - 3 days

SKU: BX8070110100F Category:

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Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.



Specifications

Processor manufacturerIntel
Processor generation10th gen Intel® Core™ i3
Processor modeli3-10100F
Processor base frequency3.6 GHz
Processor familyIntel® Core™ i3
Processor cores4
Processor socketLGA 1200 (Socket H5)
Component forPC
Processor lithography14 nm
Processor threads8
System bus rate8 GT/s
Processor operating modes64-bit
Processor boost frequency4.3 GHz
Processor cache6 MB
Processor cache typeSmart Cache
Thermal Design Power (TDP)65 W
BoxY
Cooler includedY
Memory bandwidth supported by processor (max)41.6 GB/s
Processor codenameComet Lake
Processor ARK ID203473
Maximum internal memory supported by processor128 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Memory channelsDual-channel
ECCN
On-board graphics cardN
Discrete graphics cardN
On-board graphics card modelNot available
Discrete graphics card modelNot available
Execute Disable BitY
Idle StatesY
Thermal Monitoring TechnologiesY
Market segmentDesktop
Maximum number of PCI Express lanes16
PCI Express slots version3.0
PCI Express configurations1x16,2x8,1x8+2x4
Supported instruction setsSSE4.1,SSE4.2,AVX 2.0
Scalability1S
CPU configuration (max)1
Embedded options availableN
Thermal solution specificationPCG 2015C
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992C
Commodity Classification Automated Tracking System (CCATS)G077159
Intel® Hyper Threading Technology (Intel® HT Technology)Y
Intel® Identity Protection Technology (Intel® IPT)Y
Intel® Turbo Boost Technology2.0
Intel® AES New Instructions (Intel® AES-NI)Y
Enhanced Intel SpeedStep TechnologyY
Intel Trusted Execution TechnologyN
Intel® Thermal Velocity BoostN
Intel® Turbo Boost Technology 2.0 frequency4.3 GHz
Intel® Transactional Synchronization ExtensionsN
Intel VT-x with Extended Page Tables (EPT)Y
Intel® Secure KeyY
Intel Stable Image Platform Program (SIPP)N
Intel® OS GuardY
Intel Software Guard Extensions (Intel SGX)Y
Intel 64Y
Intel Virtualization Technology (VT-x)Y
Intel Virtualization Technology for Directed I/O (VT-d)Y
Intel Turbo Boost Max Technology 3.0N
Intel® Optane™ Memory ReadyY
Intel® Boot GuardY
Intel® vPro™ Platform EligibilityN
Tjunction100 °C
Launch dateQ4'20
StatusLaunched
Supported memory typesDDR4-SDRAM
Package typeRetail box
Processor package size37.5 x 37.5 mm
Maximum internal memory128 GB
Manufacturer

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Specifications

Processor manufacturerIntel
Processor generation10th gen Intel® Core™ i3
Processor modeli3-10100F
Processor base frequency3.6 GHz
Processor familyIntel® Core™ i3
Processor cores4
Processor socketLGA 1200 (Socket H5)
Component forPC
Processor lithography14 nm
Processor threads8
System bus rate8 GT/s
Processor operating modes64-bit
Processor boost frequency4.3 GHz
Processor cache6 MB
Processor cache typeSmart Cache
Thermal Design Power (TDP)65 W
BoxY
Cooler includedY
Memory bandwidth supported by processor (max)41.6 GB/s
Processor codenameComet Lake
Processor ARK ID203473
Maximum internal memory supported by processor128 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Memory channelsDual-channel
ECCN
On-board graphics cardN
Discrete graphics cardN
On-board graphics card modelNot available
Discrete graphics card modelNot available
Execute Disable BitY
Idle StatesY
Thermal Monitoring TechnologiesY
Market segmentDesktop
Maximum number of PCI Express lanes16
PCI Express slots version3.0
PCI Express configurations1x16,2x8,1x8+2x4
Supported instruction setsSSE4.1,SSE4.2,AVX 2.0
Scalability1S
CPU configuration (max)1
Embedded options availableN
Thermal solution specificationPCG 2015C
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992C
Commodity Classification Automated Tracking System (CCATS)G077159
Intel® Hyper Threading Technology (Intel® HT Technology)Y
Intel® Identity Protection Technology (Intel® IPT)Y
Intel® Turbo Boost Technology2.0
Intel® AES New Instructions (Intel® AES-NI)Y
Enhanced Intel SpeedStep TechnologyY
Intel Trusted Execution TechnologyN
Intel® Thermal Velocity BoostN
Intel® Turbo Boost Technology 2.0 frequency4.3 GHz
Intel® Transactional Synchronization ExtensionsN
Intel VT-x with Extended Page Tables (EPT)Y
Intel® Secure KeyY
Intel Stable Image Platform Program (SIPP)N
Intel® OS GuardY
Intel Software Guard Extensions (Intel SGX)Y
Intel 64Y
Intel Virtualization Technology (VT-x)Y
Intel Virtualization Technology for Directed I/O (VT-d)Y
Intel Turbo Boost Max Technology 3.0N
Intel® Optane™ Memory ReadyY
Intel® Boot GuardY
Intel® vPro™ Platform EligibilityN
Tjunction100 °C
Launch dateQ4'20
StatusLaunched
Supported memory typesDDR4-SDRAM
Package typeRetail box
Processor package size37.5 x 37.5 mm
Maximum internal memory128 GB